Workflow / Capabilities / Hardware engineering process
Hardware engineering · process deck
Hardware engineering process deck
From business analysis and requirements to schematics, simulation, prototype, manufacturing, testing, fixes, CE preparation, and handover documentation.
Groups
00 Route01 Analysis02 Design docs03 Components04 Build & test
Deck logic
Define the task, document the design, choose components, prototype, test, correct, and prepare evidence for production and CE work.
Slide 01 · Route
Hardware engineering workflow
Business analysis → requirements → architecture/design documents → component alternatives → schematic/simulation → PCB routing → prototype → testing → fixes → CE-ready documentation.
Architecture Schematic Simulation Prototype Testing CE preparation
Next
Slide 02 · Analysis
Business analysis and requirements
We can start from a business or system problem and convert it into hardware requirements.
Business context Use case, expected result, cost and time constraints.
Requirements Interfaces, power, signals, environment, safety limits.
Acceptance Measurable electrical, mechanical, and test criteria.
Next
Gate A Task is measurable Hardware work starts when constraints and acceptance criteria are explicit.
Slide 03 · Documentation
Architecture and design documents
Documentation is prepared before implementation and used as the basis for review, procurement, manufacturing, and tests.
Architecture doc Structural diagrams, blocks, interfaces, power domains.
Design description Operating logic, constraints, assumptions, design decisions.
Test basis Test plan, acceptance criteria, expected measurements.
Next
Artifacts Requirements, architecture document, design document, interface notes, test plan.
Slide 04 · Components
Alternative components and procurement
Component selection is treated as an engineering and delivery risk, not only as a BOM task.
Alternatives Functional equivalents, packages, ratings, lifecycle status.
Risks Availability, lead time, cost, certification impact.
Procurement BOM, supplier checks, ordering, delivery tracking.
Next
Gate B BOM is buildable Critical parts, substitutes, and delivery risks are visible before layout and manufacturing.
Slide 05 · Design
Schematic, simulation, and prototype
We move from documented architecture to circuit design, checks, prototype package, and hardware-firmware proof points.
Structural schemes, principal schematics, and review diagrams.
Simulation for critical electrical behavior and margins.
PCB layout, routing, design rules, connectors, and test points.
Hardware-firmware prototype for early interface validation.
Next
Document → Schematic → Simulation → PCB → Prototype
Slide 06 · Verification
Manufacturing, testing, and fixes
The first build is used to close the design loop with measurements, issue tracking, and controlled corrections.
Manufacturing Gerber/ODB++, BOM, assembly files, drawings, notes.
Testing Inspection, bring-up, measurements, functional checks.
Corrections Rework notes, design changes, retest, updated release files.
Next
Evidence Test plan, test report, measurements, issue list, fixes, retest notes.
Slide 07 · Release
CE preparation and handover
We prepare the design and documentation package so the product can move toward CE assessment, production, and support.
CE preparation Risk notes, electrical limits, EMC-related design inputs, test evidence.
Supporting docs BOM, schematics, PCB files, assembly notes, test reports.
Handover Release package, known limits, open risks, next revision notes.
Loop to start
Gate C Ready for review The output is buildable, testable, documented, and ready for the next release step.
Contact
Send a short hardware context
Useful inputs: business goal, expected function, interfaces, power/signals, environment, existing schematics, BOM, mechanical constraints, target standards, and test expectations.
solution@contimech.org